摘要
对焊料与金属材料对陶瓷/金属封接强度的影响进行了初步分析与探讨。发现:用AuCu、AuNi焊料焊接陶瓷/可伐时,因为封接件的断裂模式为大量Mo-Ni分层,所以平均封接强度只有80MPa;用AgCu、PdAgCu焊料焊接陶瓷/可伐时,封接件的断裂模式为Mo-Mo分层或Mo-Ni分层,平均封接强度在100MPa左右;用Ag、Cu焊料焊接陶瓷/可伐时,封接件的断裂模式为粘瓷或瓷断,平均封接强度达150MPa。用AgCu、PdAgCu、AuCu焊料焊接陶瓷/无氧铜时,因为封接件的断裂模式为粘瓷或瓷断,所以平均封接强度在150MPa左右,比用同种焊料焊接陶瓷/可伐时最高提高了80%。
The method of making strong metal-ceramic seals by brazing is investigated in this paper. When metal-ceramic sealing is done with Ag/Cu eutectic alloy,Pd/ Ag/Cu,Au/Cu, we found that strong seals could be attained on a metalizing alumina with Cu, the seal strength are about 150 MPa. However, when the same brazing is applied to alumina with kovar, unsatisfactory sealing was formed. When Ag/Cu eutectic alloy,Pd/Ag/Cu are used, strength are about 100 MPa; When Au/Cu, Au/Ni are used, strength are only about 80 MPa.
出处
《真空电子技术》
2012年第4期21-23,共3页
Vacuum Electronics
关键词
封接强度
焊料
金属
Seal strength, Braze, Metal
