摘要
针对近紫外LED在长期使用中,因封装材料光降解与热积累所导致使用寿命缩短的问题,本研究选取峰值波长为360 nm的三款LED,并结合焊点温度分析退化机制的方法,对比研究半无机封装(石英-硅胶)与全无机封装(陶瓷-金属)及国产与进口产品的可靠性差异。试验结果为封装工艺优化及寿命预测提供数据支撑。
In response to the issue of shortened service life of near-ultraviolet LEDs caused by light degradation of encapsulation materials and heat accumulation during long-term use,three types of LEDs with a peak wavelength of 360 nm were selected.By combining solder joint temperature analysis with degradation mechanism methods,a comparative study was conducted on the reliability differences between semi-inorganic encapsulation(quartz-silicone)and fully inorganic encapsulation(ceramic-metal),as well as between domestic and imported products.The experimental results provide data support for encapsulation process optimization and lifetime prediction.
作者
邓锡康
DENG Xikang(Guangdong Dongguan Quality Supervision&Testing Center,Dongguan 523073,China)
出处
《照明工程学报》
2025年第5期21-26,共6页
China Illuminating Engineering Journal
基金
广东省市场监督管理局科技项目“紫外LED(UVA)加速工作寿命测试方法研究”(2023CZ20)。
