摘要
发光二极管作为第四代照明光源,随着功率的不断增大,散热问题成为大功率LED灯具实现产业化亟待解决的关键问题之一。该文综合ANSYS和Pro/E两个软件的优势进行LED热仿真。在Pro/E中建立灯具模型,导入ANSYS后通过优化模型、网格划分、施加载荷和边界条件,求解可以得到LED灯的温度场分布。运用该方法可对复杂LED灯具进行了热仿真,得到了一款散热器的最大功率容量,并分析了芯片排布等因素对散热的影响。
LED is the fourth generation light source,but heat dissipation is one of the key problems with the increasing power which will influence the high-power LED to popularization.ANSYS and Pro/E is combined to realize LED thermal simulation.LED structure is modeled in Pro/E and imported into ANSYS.After model optimization,meshing,loads applying,and boundary and solving,the temperature distribution of LED lamp will obtained.This method is easier for the thermal simulation of the complex model.In this paper,the maximum power capacity of a type of heat sink is analyzed,the chip arrangement and other factors on the heat dissipation effects is also discussed.
出处
《杭州电子科技大学学报（自然科学版）》
2011年第5期13-16,共4页
Journal of Hangzhou Dianzi University：Natural Sciences
基金
浙江省自然科学基金面上资助项目(Y1110992)
