期刊文献+

照明用大功率LED射灯散热建模研究 被引量:7

Heat Dissipation Modeling Research of High Power LED Spot Lamp for Lighting
原文传递
导出
摘要 散热问题是LED灯具成为新一代照明光源亟待解决的关键问题之一。提出一种LED灯具散热建模方法:选用LED射灯作为代表产品进行散热建模研究,采用三维造型软件建立LED灯具产品三维模型,然后导入有限元流体热分析软件(CFD)进行热仿真。研究散热仿真过程中的热阻设置、热量载荷计算和边界条件设定等关键问题,并求解LED射灯的工作温度分布情况;将仿真分析结果与实验室测试数据进行对比分析研究。研究结果表明,运用该方法可以对室内照明LED灯具进行较为准确的散热分析,仿真温度误差在4℃左右,仿真结果对灯具开发设计具有重要参考价值。 Heat dissipation is one of the key problems need to be solved for LED lamps as a new generation of lighting light. A heat dissipation modeling method was presented for the LED lamp. The LED spot lamp was selected for dissipative research, 3D models were established by modeling softwares, then the models were transferred into finite element thermal analysis software (CFD) for simulation. Several key aspects such as thermal resistance setting, heat load calculation and boundary conditions were considered in the analysis process, and the simulation result was compared with laboratory test data. The results show that the method can be used for accurate thermal analysis simulation of indoor LED lighting, with the temperature error less than 4 ℃, and the simulation result is of a great reference value for lighting design.
出处 《半导体技术》 CAS CSCD 北大核心 2013年第1期60-64,共5页 Semiconductor Technology
基金 国家科技支撑计划项目(2011BAE01B10) 国家高技术研究发展计划(863计划)资助项目(2011AA03A109)
关键词 照明 LED射灯 散热 建模 仿真 lighting LED spot lamp heat dissipation modeling simulation
  • 相关文献

参考文献13

二级参考文献51

共引文献116

同被引文献56

  • 1董如何,肖必华,方永水.正交试验设计的理论分析方法及应用[J].安徽建筑工业学院学报(自然科学版),2004,12(6):103-106. 被引量:248
  • 2BILLINGSK.开关电源手册[M].张占松,汪仁煌,谢丽萍,译.北京:人民邮电出版社,2006.
  • 3饶连江.基于ANSYS的LED灯具热分析[J].照明工程学报,2010,21(1):53-57.
  • 4毛行奎,陈为.开关电源高频功率平面变压器热设计研究[J].电工电能新技术,2007,26(4):21-25. 被引量:9
  • 5Lin MT,YingSP, LinM Y, etal. High power LED package with vertical structure [J]. Microelectron. Reliability, 2012, 52(5): 878-883.
  • 6Arik M,Petroski J, Weaver S. Thermal challenges in the future generation solid state lighting applications: light emitting diodes[C]//Proc, of IEEE 8th Thermal and Thermomechanical Phenomena in Electron. Systems Conf. , 2002: 113-120.
  • 7Kim D K,Jung J, Kim S J. Thermal optimization of plate-fin heat sinks with variable fin thickness [J]. International J. Heat and Mass Transfer, 2010, 53 (25) : 5988-5995.
  • 8Dialameh L, Yaghoubi M, Abouali O. Natural convection from an array of horizontal rectangular thick fins with short length [J]. Appl. Thermal Engin. , 2008, 28(17): 2371-2379.
  • 9Kim Y W,Kim J P,Kim J B,et al. Thermal analysis of a package substrate with filling via-hole for COB LED Packaging[J]. Korean J. Phys. Society, 2009,54 (5) : 1873-1878.
  • 10Yu S H,Lee K S, Yook S J. Optimum design of a radial heat sink under natural convection [J ]. International J. Heat and Mass Transfer, 2011, 54 (11) : 2499-2505.

引证文献7

二级引证文献22

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部