摘要
利用赫尔槽试验研究了烷基磺酸盐电镀锡铅合金工艺中电流密度、主盐浓度、游离酸浓度及温度对镀层厚度和组成的影响。
The effects of bath composition, cathodic current density and temperature of alkylsulfonate base tin-lead alloy electroplating on tin content and thickness of electrodeposits were studied through Hull cell test.
出处
《电镀与涂饰》
CAS
CSCD
2000年第1期36-38,共3页
Electroplating & Finishing
