摘要
介绍了一种新的甲基磺酸盐电镀哑光纯锡工艺,研究了各工艺条件变化对镀层沉积速度的影响,并用环境扫描电镜(SEM)观察了镀层形貌。研究发现,随着镀液中甲基磺酸锡浓度的增加,镀层的沉积速度逐渐增大。电流密度大小几乎与镀层的沉积速度成线性关系。镀液温度对沉积速度有较大影响,温度低时,镀层的沉积速度快且结晶细密,镀层光亮;随着镀液温度的升高,镀层的沉积速度先减小再逐渐增大,但温度过高时,析氢严重,电流效率下降。
A process for the preparation of electroplated dumb-bright tin coating from methyl-sulphonate bath was established.Thus the effects of plating parameters on the deposition rate of the tin coating were investigated,while the morphology of the coating was observed using a scanning electron microscope.It was found that the deposition rate of the tin coating increased with increasing concentration of methyl-sulphonate in the plating bath.The deposition rate was almost linearly proportional to the current density,and the temperature of the plating bath had a significant effect on the deposition rate.Namely,the deposition rate was faster at a lower temperature of the plating bath,and the corresponding tin coating was composed of fine crystals and bright as well.With increasing temperature of the plating bath,the deposition rate of the tin coating decreased first and then gradually increased,but hydrogen evolution became severe and the current efficiency decreased at a too high temperature of the plating bath.
出处
《材料保护》
CAS
CSCD
北大核心
2007年第7期30-31,共2页
Materials Protection
关键词
甲基磺酸
电镀锡
沉积速度
工艺
methyl-sulphonate
tin electroplating
deposition rate
process
