摘要
首先简要介绍了一下热传输原理,而后应用有限元探索了双列直插式元件及印制电路板(PCB) 的二维和三维稳态热传输,通过计算实例的温度场分布对两种方式作比较,并通过点测进行实验研究,计算与实验测量相吻合,给出结论,有限元三维模拟比二维模拟更为复杂。
Heat transfer was introduced. The finite element method (FEM) is used to investigate steady state two and three dimensional heat transfer in dual in line component and PCB. Two methods are compared through real examples' temperature distribution. And experiments with point test method are done to compare with the results of calculated and results are much in accord with each other. Conclusion is also given that three dimensional finite element method is more complex and with it more particular messages could be obtained.
出处
《北京航空航天大学学报》
EI
CAS
CSCD
北大核心
2000年第1期5-7,共3页
Journal of Beijing University of Aeronautics and Astronautics
基金
国家部委基金
