摘要
通过有限元分析，计算了不同工艺条件下阳极焊界面处电场强度的分布和大小．结果表明：界面处微观区域内总存在一个最大场强值，其电场强度最大值点在界面处的阴极表面凸起处，当最大场强值与研究材料击穿电压为同一数量级时，可引起局部击穿，从而促使离子扩散，实现阳极焊．
The interface electric field for anodic bonding is calculated for different conditions by the finite elements analysis. At least one maximum for the field is found to prevail at the microcosmic region at the interface. This is local to the highest point of negative surface. When the maximum value is of the same order of magnitude to the local striking off voltage, then ionic diffusion in anodic bonding could take place.
出处
《西安交通大学学报》
EI
CAS
CSCD
北大核心
2000年第1期62-65,共4页
Journal of Xi'an Jiaotong University
关键词
阳极焊
界面
电场
铝
钠玻璃
Anodic bonding
interface
electric field
