摘要
PCB电镀铜阳极的发展演变历程,并对各种不同类型阳极进行对比分析。
This article mainly introduced the development of PCB copper plating anode, then make comparison and analysis on their difference between different anode type.
出处
《印制电路信息》
2011年第12期40-44,共5页
Printed Circuit Information
关键词
电镀
可溶性阳极
不溶性阳极
发展
plating
soluble anode
insoluble anode
development
