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基于机器视觉的IC芯片三维引脚外观检测机的研制 被引量:3

Development of the 3D lead inspection machine for integrated circuit chip based on machine vision
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摘要 介绍了集成电路芯片三维引脚外观检测机的系统组成与功能、运动控制系统与视觉检测系统的构成、图像处理方法以及系统软件的模块结构。该检测机由芯片自动输送线、视觉检测平台、吸臂和分选臂等组成,采用工控机及PLC控制技术,实现芯片上料、输送、外观检测、分选补给和卸料等功能的全自动化。该检测机可检测芯片引脚在空间的11个尺寸参数,具有检测精度高、产品更换快速和操作方便等优点,适用于QFP集成电路芯片三维引脚外观的自动检测,可显著提高生产效率及产品质量。 The constitution and function of the 3D lead inspection machine for integrated circuit chip ,structure of the motion control system and vision system, image processing method and software frame are introduced. The machine is composed of automatic conveyor, computer vision platform, picking jib, sorting jib and so on. It is controlled by the industrial control computer and PLC system. The automation for loading, conveying, vision inspection, sorting, replenishment and unloading is achieved. 11 size parameters of integrated circuit chip lead can be inspected by the machine. The machine has the advantage that is high inspection preci- sion, little conversion time and easy operation. It can be applied to the 3D lead inspection for QFP series integrated circuits chip. The production efficiency and the product quality would be improved greatly.
出处 《现代制造工程》 CSCD 北大核心 2011年第11期105-108,共4页 Modern Manufacturing Engineering
关键词 集成电路芯片 三维引脚外观 机器视觉 自动检测 integrated circuit chip 3D lead appearance machine vision automatic inspection
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参考文献3

  • 1鲜飞.芯片封装技术的发展趋势[J].中国集成电路,2006,15(2):73-76. 被引量:4
  • 2郑南宁.机器视觉与模式识别[M].北京:国防工业出版社,1998.169-190.
  • 3Yasser Hawari, Momoh J E Salami, Abdurazzag Ali Aburas. Fuzzy Based Technique for Microchip Lead Inspection Using Machine Vision [ C ]. ICCCE 2008 International Conference on Computer and Communication Engineering,2008.

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