摘要
通过韧性树脂改性环氧树脂,制备了一种树脂胶液,将高导热无机填料通过复配方式均匀分散到该胶液中,制得一种可用于金属基覆铜板上的高导热胶膜。结果表明：改性后的树脂胶液所制得的胶膜剥离强度、柔韧性和耐热性较高。用填料填充后制成的高导热胶膜的热导率为2.45 W/m·k,剥离强度为1.05~1.1 N/mm,且具有较好的耐热性。
A kind of adhesive resin was prepared by using toughened resin modified epoxy resin with 2.67 N/mm of high peel strength,high temperature resistance and excellent flexibility.With high thermal conductive fillers evenly dispersing into the resin through complex loading,a novel highthermal conductive adhesive film was developed which has 2.45 W/m·K of high thermal conductivity,1.05～1.1 N/mm of peel strength,high electric strength and temperature resistance and good for used in CCL.
出处
《绝缘材料》
CAS
北大核心
2011年第2期17-20,共4页
Insulating Materials
基金
粤港关键领域重点突破项目(2008A011800001)
国家科技部支撑计划(2007BAE46B01)
关键词
高导热
胶膜
金属基覆铜板
high thermal conductivity
adhesive film
metal-based copper clad laminate（CCL）
