摘要
总结了电气电子领域使用的六方氮化硼(hexagonal boron nitride,h BN)导热填料制备方法,介绍了近几年h BN填充树脂基复合材料的研究进展,研究了导热树脂复合材料的导热机理和导热模型,讨论了h BN填料的形貌、粒度、颗粒复配及表面改性方法等因素对材料导热性能的影响,并对h BN填充高导热树脂复合材料的发展方向进行了展望。
Development and preparation of heat conducted resin composites filled with hexagonal boron nitride（hBN） used in electrical and electronics field were studied.The mechanism and model of thermal conductivity were introduced.The effects of morphology,particle size,particle mixing,and surface modification of h BN filler on the resin composites were discussed.Finally,the prospect of the resin composites filled with h BN was proposed.
出处
《粉末冶金技术》
CAS
CSCD
北大核心
2017年第1期68-72,78,共6页
Powder Metallurgy Technology
基金
国家自然科学基金资助项目(51471023)
关键词
六方氮化硼填料
导热
树脂
表面改性
hexagonal boron nitride（hBN） filler
thermal conductivity
resin
surface modification
