摘要
通过添加导热填料对云母胶进行改性,制备出具有较高导热性的胶粘剂。通过测试胶粘剂的导热系数、介电性能,电绝缘性能,系统研究了导热填料的用量、粒径、形状、晶型、种类等因素与胶粘剂导热系数的对应关系。结果表明,导热填料的最佳用量为32%(体积分数);云母胶的导热系数均随着所掺杂粉体粒径的增大而提高;相比于微孔形SiO2,球形SiO2对云母胶导热系数提升较高;在相同条件下,5μmBN和α-Al2O3能最大程度地提高云母胶热导率;相比于γ-Al2O3,α-Al2O3对云母胶导热系数提升较高。
An adhesive with high thermal conductivity was prepared by adding thermal conductive fillers to modify an adhesive for mica tape.Tests were made on the adhesive samples＇ thermal conductivity,dielectric properties,and electrical insulation properties.The correspondence relation between thermal conductivity of the adhesive and its factors such as the content,size,shape,crystal type and species of fillers was systematically studied.The results indicate that the optimum dosage of filler should be 32%;the conductivity of the adhesive would increase with an increase in diameter of doped fillers＇ particle.Compared to pore-shaped SiO2,spherical-shaped SiO2 contributes more to the conductivity of the adhesive.Under the same conditions,5 μmBN and α-Al2O3 could increase the conductivity of the adhesive to the maximum.Compared to γ-Al2O3,α-Al2O3 contributes more to the conductivity of the adhesive.
出处
《绝缘材料》
CAS
北大核心
2011年第1期61-65,共5页
Insulating Materials
基金
国家科技支撑计划项目(2007BAA05B05)子课题资助
关键词
高导热
填料
胶粘剂
high thermal conductivity
filler
adhesive
