摘要
采用绢云母粉,α-氧化铝粉及硅微粉制备了换位填充腻子,研究了粉体用量对固化物性能的影响。结果表明：采用云母粉填充时,固化物的热变形温度最高,达190200℃,但导热系数最小,仅为0.91.0 W/（m.K）;采用α-氧化铝填充时,最大填充量可接近80%,固化物的导热系数可达2 W/（m.K）;采用硅微粉填充时,固化物的性能介于云母粉和α-氧化铝粉填充固化物性能之间。
Several kinds of transposition filling putties were prepared with sericite,α-alumina and silicon powder.The properties of the cured putties were investigated.The results show that the heat deflection temperature（190～200 ℃） is at the highest when the putty is filled with sericite powder,while the thermal conductivity at the lowest,merely 0.9～1.0 W/（m·K）.When filled with α-alumina,the greatest filling amount is about 80%,the thermal conductivity of the cured putty is greater than 2 W/（m·K）.When filled with silicon powder,the property of the cured putty is between that with sericite and α-alumina.
出处
《绝缘材料》
CAS
北大核心
2009年第6期64-66,共3页
Insulating Materials
基金
广西科学基金项目"高导热绝缘浸渍树脂"(桂科基0832015)
广西科学研究与技术开发计划项目"导热绝缘材料"(桂科能0842003-2)
广西研究生教育创新人才基地项目资助
关键词
高导热
换位填充
绝缘腻子
high thermal conduction
transposition and filling
insulation putty
