摘要
采用熔铸法制备了CeO_(2)纳米颗粒增强的Sn58Bi复合钎料,研究了CeO_(2)纳米颗粒对Sn58Bi钎料及其钎焊接头组织与性能的影响。结果表明:添加CeO_(2)纳米颗粒,细化了Sn58Bi钎料的共晶组织,Bi相由块状逐渐转变为细条状;添加0.125~0.5 mass%的CeO_(2)纳米颗粒提高了复合钎料的润湿性;在添加量0.5 mass%时复合钎料的抗拉强度最大,为68.9 MPa,较基体钎料提升37%;复合钎料与Cu基板可实现良好焊接。添加CeO_(2)纳米颗粒降低了钎焊接头界面金属间化合物(IMC)层的厚度,形态由棒状转变为较为平整的扇贝状,钎焊接头剪切强度提高;当添加量为0.5 mass%时,钎焊接头的剪切强度最大,为45.4 MPa,较于基体钎料接头提升了32.4%,断裂位置由基体钎料接头的IMC/Cu基板界面向IMC/钎缝界面迁移;断裂机制由呈片状解理刻面+少量冰糖状IMC解理组成的脆性断裂转变为钎缝准解理为主的韧-脆混合断裂。
CeO_(2)nanoparticles reinforced Sn58Bi composite solder was prepared by melting casting method,and the effect of CeO_(2)nanoparticles on microstructure and properties of the Sn58Bi solder and its solder joints was studied.The results show that the addition of CeO_(2)nanoparticles refines the eutectic structure of the Sn58Bi solder,and the Bi phase gradually transforms from block-like to fine needlelike.The addition of 0.125-0.5 mass%CeO_(2)nanoparticles improves the wettability of the composite solders.When the addition amount reaches 0.5 mass%,the tensile strength of the composite solder is the highest of 68.9 MPa,which is 37%higher than that of the matrix solder.Composite solder can achieve good welding with Cu substrates.The addition of CeO_(2)nanoparticles reduces the thickness of the intermetallic compound(IMC)layer at the interface of the solder joint,and the morphology changes from rod-shaped to relatively flat fanshaped,resulting in an increase in the shear strength of the solder joint.When the addition amount is 0.5 mass%,the maximum shear strength of the solder joint is 45.4 MPa,which is 32.4%higher than that of the matrix solder joint.The fracture position shifts from the IMC/Cu substrate interface of the matrix solder joint to the IMC/solder joint interface.The fracture mechanism changes from brittle fracture composed of lamellar cleavage facets and a small amount of dendritic IMC cleavage to ductile-brittle mixed fracture dominated by quasi-cleavage of the solder.
作者
陈伟明
张柯柯
范玉春
张海洲
张超
CHEN Wei-ming;ZHANG Ke-ke;FAN Yu-chun;ZHANG Hai-zhou;ZHANG Chao(School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China;School of Mechanical and Electrical Engineering,Luo Yang Polytechnic,Luoyang 471000,China)
出处
《材料热处理学报》
北大核心
2025年第3期215-225,共11页
Transactions of Materials and Heat Treatment
基金
国家自然科学基金(U1604132)
中原基础研究领军人才(ZYYCYU202012130)
河南省国际合作重点项目(2024100014)
河南省科技攻关项目(242102230048)。
