摘要
采用热变形+固溶+热变形+冷变形+时效工艺制备了Cu-0.92Cr合金试样,测试了试样的硬度和电导率,并进行了微观组织观察,研究了热变形后时效工艺对Cu-0.92Cr合金组织和性能的影响。结果表明,在试验参数范围内,随着时效温度的升高和时间的延长,合金的硬度逐渐下降,电导率升高。在420℃×6h时效后,合金硬度(HB)为130.3,电导率可达52.49MS/m。组织观察表明,经时效后析出相为具有面心立方结构、晶格参数为0.424nm的化合物,颗粒大小约为4～15nm,颗粒间距为10～30nm。
The Cu-0.92Cr alloy was prepared by thermal deformation-solid solution-thermal deformation-cold deformation-aging treatment.The hardness and electric conductivity of the Cu-0.92Cr alloy have been examined,and microstructure of the alloy with aging at 420 ℃ for 6h was observed to understand effects of aging process on microstructure and properties of Cu-0.92Cr alloy after thermal deformation.The results reveal that with increasing in aging temperature and time,hardness of the alloy is gradually decreased and electric conductivity is increased.The hardness and electric conductivity of the alloy with aging at 420℃ for 6h reach up to 130.3HB and 52.49MS/m,respectively.The Cu-0.92Cr alloy is characterized by uniform distribution of precipitates in Cu matrix.The precipitates are found to have the f.c.c structure with the lattice parameter of 0.424nm,and particle size is approximately 4～15nm with grain spacing approximately 10～30nm.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2010年第11期1074-1076,共3页
Special Casting & Nonferrous Alloys
基金
国家自然科学基金资助项目(51075122)
河南省科技创新杰出青年基金资助项目(094100510005)
洛阳市科技攻关项目(0903041A)
关键词
CU-CR合金
热变形
时效
硬度
电导率
Cu-Cr Alloy,Thermal Deformation,Aging,Hardness,Electric Conductivity
