摘要
以第2代聚酰亚胺(Polyim ide-Ⅱ,PI-Ⅱ)为基体,采用纤维缠绕成型工艺制作了T700/PI-Ⅱ(碳纤维/Polyim ide-Ⅱ)、S2/PI-Ⅱ(高强玻璃纤维/Polyim ide-Ⅱ)复合材料。研究了纤维缠绕成型PI-Ⅱ复合材料的界面性能和耐热性能。采用扫描电镜(SEM)研究了T700/PI-Ⅱ以及S2/PI-Ⅱ复合材料的剪切断口形貌,用于分析PI-Ⅱ复合材料的界面性能;采用TG/DTA 6300热分析仪测定T700/PI-Ⅱ以及S2/PI-Ⅱ复合材料的热分解温度,用于研究T700/PI-Ⅱ以及S2/PI-Ⅱ复合材料的耐热性能。本文研究也包括S2/PI-Ⅱ复合材料在300℃高温的层间剪切强度保留率。研究结果表明:T700/PI-Ⅱ复合材料在空气氛围中的起始热分解温度(TID)为549℃,S2/PI-Ⅱ复合材料为542℃。S2/PI-Ⅱ复合材料在300℃高温的层间剪切强度保留率为72%。
In this article,the second generation Polyimide（Polyimide-Ⅱ,PI-Ⅱ）was chosen in this research to study interfacial and heat resistant properties of T700/PI-Ⅱ（carbon/ PI-Ⅱ） and S2/PI-Ⅱ（High-strength glass fiber /PI-Ⅱ）composites made by filament winding process.The shear fracture pattern of section of T700/PI-Ⅱ and S2/PI-Ⅱcomposites was observed by means of SEM for analyzing interfacial properties of PI-Ⅱmatrix composites.The heat decomposition temperature of T700/PI-Ⅱ and S2/PI-Ⅱcomposites was separately tested by TG/DTA apparatus for the research on heat resistant properties of T700/PI-Ⅱand S2/PI-Ⅱcomposites;The study also included the retained rate of ILSS（Interlaminar Shear Strength）of S2/ PI-Ⅱ composites at 300℃.The research showed that interfacial and heat resistant properties of PI-Ⅱ matrix composites made by filament winding process achieved desirable results.The retained rate of ILSS of S2/ PI-Ⅱ composites was 72% at 300℃,the initial heat decomposition temperature of T700/PI-Ⅱcomposite was 549℃ in the air,and that of S2/PI-Ⅱcomposite was 542℃.
出处
《纤维复合材料》
CAS
2010年第3期3-5,共3页
Fiber Composites
