摘要
研究和比较了自制金锡合金焊膏与金锡合金箔材的相关性能。实验结果表明:金锡合金钎料焊膏的铺展性及润湿性优于箔材钎料;接头的显微组织和结构基本相同;在大气条件下,焊膏的钎焊性能比箔材钎料好;焊膏的剪切强度略低于箔材钎料。
Studies on performance and comparison of the self-made Au-Sn solder paste and solder foil were carried out. The results show that the spread ability and wettability of the Au-Sn alloy solder paste are better than those of foil. The microstructures of the joints are basically the same. Under atmospheric conditions, the brazing performance of the solder paste is better than the foil. The shear strength of the solder paste is slightly lower than the foil.
出处
《贵金属》
CAS
CSCD
北大核心
2013年第1期25-28,共4页
Precious Metals
关键词
金属材料
金锡合金
焊膏
箔材
性能对比
无铅钎料
metal materials
Au-Sn alloy
solder paste
foil
performance comparison
lead-free solder
