摘要
统计过程控制(SPC)技术已广泛用于半导体器件生产,采用SPC技术可以提高半导体器件的质量和可靠性。利用控制图可以监控生产过程状态,对生产中出现的异常及时进行分析、改进,使半导体器件工艺的生产过程处于受控状态。介绍了SPC技术的基本概念和技术控制流程、常规控制图及其分类以及引用的国家标准。给出了目前的工序能力指数(Cp)的控制水平、工序能力指数和工艺成品率及不合格品率的对应关系,以及几种在常规控制图基础上扩展的适合半导体器件工艺的其他控制图技术,分析了国内某半导体器件生产线SPC技术的利用情况及存在的问题。
The SPC technique is widely used in semiconductor device production,because it can improve the quality and reliability of semiconductor devices.The control chart can be used to monitor the status of production process,analyze and improve the exceptions occurred during the process timely,so as to keep the production process of semiconductor devices under control.The basic concept and technique control procedure of SPC,regular control chart,its classification and referenced national standard are presented.Meanwhile,the relationship of the control level of current process capability index（Cp）,process capability index,yield and percent defective is given.Additionally,other control chart techniques fitting for semiconductor device process based on several regular control charts are also introduced.Finally,the application of SPC technique in a domestic semiconductor device production line and existing problems are briefly analyzed.
出处
《微纳电子技术》
CAS
北大核心
2010年第8期518-521,共4页
Micronanoelectronic Technology
关键词
统计过程控制
半导体器件
控制图
工序能力指数
成品率
statistical process control（SPC）
semiconductor device
control chart
process capability index
yield
