期刊文献+

温度对Ni-P化学镀层结合力影响的研究 被引量:5

Investigation of Effect of Temperature on the Binding Force of Ni-P Chemical Plating
在线阅读 下载PDF
导出
摘要 用弯曲法、划痕法研究了镀后加热温度对Ni-P化学镀层结合力的影响,结果表明:镀后退火温度越高,镀层结合力越好,但温度过高时,镀层硬度将下降。用金相观察及电子探针分析,探讨了镀后退火温度影响结合力的机理。结果指出:退火时将在镀层和基体界面上发生Ni与Fe的互扩散,形成Ni-Fe合金扩散层,从而提高了结合力。为了能在保证镀层硬度的前提下提高结合力,本文提出了二次镀覆的设想,获得较好试验结果。 This paper studied the effect of temperature on the binding force of Ni-P chemical plating coating by winding and scratch test. The results shown that the higher the heating temperature is, the more strengthening the binding force is.The mecanism of effect of the heating temperature on the binding force of Ni-P plating coating was studied by means of metallographical test and probe-microanlyser. The results indicated where is a mutually diffuse layer of Ni and Fe while it is higher temperature heated, and it increased the binding force.At lost increasing the binding force based on assuring plating hardness the two times plating was discussed.
机构地区 大连铁道学院
出处 《热加工工艺》 CSCD 北大核心 1990年第5期16-18,35,共4页 Hot Working Technology
关键词 结合力 温度 NI-P化学镀层 Ni-P chemical plating, the binding force, mutually diffuse layer, the two times plating
  • 相关文献

同被引文献55

引证文献5

二级引证文献33

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部