摘要
着重探讨了化学镀Ｎｉ－Ｃｕ－Ｐ合金的镀液组成以及化学镀Ｎｉ－Ｃｕ－Ｐ／Ｎｉ－Ｐ双层合金的工艺条件，并采用弯曲法研究了化学镀Ｎｉ－Ｃｕ－Ｐ／Ｎｉ－Ｐ双层镀层的结合力。结果表明，当Ｎｉ－Ｃｕ－Ｐ合金镀液中的络合剂含量超过其镍盐含量的两倍时，即可抑制置换铜反应的发生，而实现镍、铜离子的共沉积，从而获得良好质量的Ｎｉ－Ｃｕ－Ｐ镀层和Ｎｉ－Ｃｕ－Ｐ／Ｎｉ－Ｐ双层镀层。化学镀Ｎｉ－Ｃｕ－Ｐ／Ｎｉ－Ｐ双层镀层因具有相对较佳的内应力分布状态，而有优越的镀层结合力。研究表明，双层化学镀是提高Ｎｉ－Ｐ镀层结合力的一条有效途径。
In this paper the bath composition of electroless Ni-Cu-P plating and the technical condition of electroless Ni-Cu-P/Ni-P double-decked coatings have been discussed emphatically,the adhesion of Ni-Cu-P/Ni-P double-decked coatings has been studied also by means of bending method. The results show that the replacement reaction of copper can be restrained when the complexing agents content in Ni-Cu-P bath exceed twice as much nickel salt,thus the nickel and copper ions can be codeposited,Ni-Cu-P and Ni-Cu-P/Ni-P coatinlgs of high quality can be obtained. Because double-decked coatings have better distribution of internal stress, it has outstanding adhesion of coating, therefore double-decked electroless plating may become an effctive way of improving adhesion of Ni-P coating.
出处
《机械工程材料》
CAS
CSCD
1994年第4期13-15,41,共4页
Materials For Mechanical Engineering
