摘要
LTCC基板上薄膜多层布线工艺是MCM-C/D多芯片组件的关键技术。它可以充分利用LTCC布线层数多、可实现无源元件埋置于基板内层、薄膜细线条等优点,从而使芯片等元器件能够在基板上更加有效地实现高密度的组装互连。文章介绍了LTCC基板上薄膜多层布线工艺技术,通过对导带形成技术、通孔柱形成技术和聚酰亚胺介质膜技术的研究,解决了在LTCC基板上薄膜多层布线中介质膜"龟裂",通孔接触电阻大、断路,对导带的保护以及电镀前的基片处理等工艺难题。
Thin film mutli-layer technology on LTCC is the key technology of MCM-C/D.It can achieve that passive components embedded in the LTCC substrate layer with use of its multi-layer layout,with thin film fine line,so that chips and other components in the substrate can achieve high-density inconnection assembly with more effectively.This paper presents thin film mutli-layer technology on LTCC,and solves some problems as follows,eletric band,open hole and polyimide medium technology.
出处
《电子与封装》
2010年第4期28-31,共4页
Electronics & Packaging
