摘要
研究了复合化学镀（Ｎｉ－Ｃｕ－Ｐ）－Ａｌ２Ｏ３的工艺与组成，复合材料的沉积速率高于Ｎｉ－Ｃｕ－Ｐ合金；随着镀液中Ａｌ２Ｏ３添加量的增加，复合镀层中Ａｌ２Ｏ３体积分数提高，达到２５ｇ／Ｌ时则不再上升，氧化铝与Ｎｉ－Ｃｕ－Ｐ合金复合，致使（Ｎｉ－Ｃｕ－Ｐ）－Ａｌ２Ｏ３的组成由非晶态过渡到晶态，随着热处理温度的升高发生不同的变化。
The technology and composition of electroless composite plating (Ni Cu P) Al 2O 3 were studied. The results show that the deposition rate of composites were higher than that of Ni Cu P,Al 2O 3 fraction of the composites was increased with the addition of the particle in the solution until attaining 25 g/L, co deposition of alumina and Ni Cu P substrate makes the microstructure transforms from amorphous to crystalline state, which changes with heat treatment.
出处
《电镀与精饰》
CAS
1998年第6期1-4,共4页
Plating & Finishing
基金
安徽省自然科学基金
中青年学科带头人培养基金
