期刊文献+

栅氧化层经时击穿物理模型应用分析 被引量:4

Application Analysis on TDDB Physical Mechanism
在线阅读 下载PDF
导出
摘要 讨论了栅氧化层击穿的统计模型,并对业界广泛应用的1/E模型、E模型以及幂指数模型中栅氧化层击穿的物理机理进行了仔细研究,指出了各个模型应用的局限性,结合实验数据分析,明确给出了各个模型的应用范围。详细讨论了电场加速因子与激活能在三个模型中的不同物理含义,总结了电场加速因子、激活能随着栅氧化层厚度变化的发展趋势以及所对应的击穿机理,据此提出了通过激活能与电场加速因子选择和验证所用加速模型是否合理的方法。此方法为判断测试条件是否合理,分析测试结果的内在含义提供了更直接、有用的参考信息。 For gate oxide breakdown, statistical models were discussed, and the associated mechanisms in three commonly used models 1/E, E, and power-law were studied. The limitations for each model were also pointed out. Based on the abundant test data, the applicable areas for each model were clearly provided. For different gate oxide thickness, the trend on the energy were given, whose physical implications in the electric-field acceleration factor and on the activation three models were illustrated. Moreover, by the trend analysis on the activation energy and the electric-field acceleration factor, a way to determine the feasibility of the acceleration model were proposed. Meanwhile, the proposed method provides useful guidelines to better define test conditions and interpret test results.
出处 《半导体技术》 CAS CSCD 北大核心 2010年第2期154-158,共5页 Semiconductor Technology
关键词 栅氧化层 经时击穿 激活能 电场加速因子 1/E模型 幂指数模型 gate oxide TDDB activation energy electric-field acceleration factor 1/E model power law model
  • 相关文献

参考文献7

  • 1KUO W, CHIEN W T, KIM T. Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing and software development [ M ]. Boston, USA : Kluwar Science, 1998 : 160-161.
  • 2CHIEN W T K, ZHAO A. Fast WLRC applications in foundry fabrication [ C ] // Proc of Int Reliability Physics Symp. San Jose, USA, 2005 : 676-677.
  • 3SCHUEGRAF K F, HU C. Hole injection oxide breakdown model for very low voltage life extrapolation [ C ] //Proc of Int Reliability Physics Symp. Atlanta, GA, USA, 1993 : 7-12.
  • 4MCPHERSON J W, BAGLEE D A. Acceleration factors for thin gate oxide stressing [ C ] // Proc of Int Reliability Physics Symp. Orlando, FL, USA, 198511-5.
  • 5WU E Y, SUNE J. Power law voltage acceleration: a key element for ultra-thin gate oxide reliability[ J ]. Microelectronic Reliability, 2005; 45 : 1809-1834.
  • 6STATHIS J H. Percolation models for gate oxide breakdown [J]. JAP, 1998,86:904-911.
  • 7SUN E J. New physics-based analytic approach to the thin oxide breakdown statistics [ J ] . EDL, IEEE, 2001,22: 296- 298.

同被引文献44

  • 1王彦刚,许铭真,谭长华,段小蓉.超薄栅氧化层n-MOSFET软击穿后的导电机制[J].物理学报,2005,54(8):3884-3888. 被引量:13
  • 2郑若成.MOS管器件击穿机理分析[J].电子与封装,2006,6(4):36-39. 被引量:4
  • 3李晓延,王志升.倒装芯片封装结构中SnAgCu焊点热疲劳寿命预测方法研究[J].机械强度,2006,28(6):893-898. 被引量:11
  • 4LU Bin,SHARMA S K.A Literature Review of IGBT Fault Diagnostic and Protection Methods for Power Inverters[J].IEEE Transactions on Industry Applications,2009,45 (5):1770-1777.
  • 5ZéANH A,DALVERNY O,KARAMA M,et al.Thermomechanical Modeling and Reliability Study of an IGBT Module for an Aeronautical Application[C].9th International Conference on Thermal,Mechanical and Multiphysies Simulation and Experiments in Micro-Electronics and Micro-Systems,Freiburg im Breisgau,Germany,2008:1-7.
  • 6RAMMINGER S,SELIGER N,Wachutka G.Reliability Model for AI Wire Bonds subjected to Heel Crack Failures[J].Microelectronics Reliability,2000,40:1521-1525.
  • 7YIN C Y,LU H,MUSALLAM M,et al.In-Service Reliability Assessmere of Solder Interconnect in Power Electronics Modules[C].2010 Prognostics & System Health Management Conference,Macao,P.R.China,2010:1-5.
  • 8FABIAN J H,HARTMANN S,HAMIDI A.Partial Discharge Failure Analysis of AIN Substrates for IGBT Modules[J].Microelectronics Reliability.2004,44:1425-1430.
  • 9WU Jie,ROSENBAUM E.Gate Oxide Reliability under ESD-Like Pulse Stress[J].IEEE Transactions on Electron Devices,2004,51 (8):1528-1532.
  • 10DU Bin,HUDGINS J L,SANTI E,et al.Transient Electro-thermal Simulation of Power Semiconductor Devices[J].IEEE Transactions on Power Electronics,2010,25(1):237-248.

引证文献4

二级引证文献6

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部