摘要
研究了硫脲、碘酸钾以及两者复合后对2024铝合金化学镀Ni-P合金镀层沉积速率的影响。结果表明:硫脲、碘酸钾都可以促进Ni-P合金在铝合金表面的沉积,且当镀液中硫脲、碘酸钾的质量浓度分别为3mg/L和20mg/L时,沉积速率都达到了最大值;并且当两者复合以后,镀层沉积速率又明显提高;当镀液中硫脲和碘酸钾的质量浓度比为1:5时,沉积速率达到最高值,此时镀层质量良好,耐蚀性高。
The effects of thiourea（TU）, KIO3 and their compounds on deposition velocity of Ni-P electroless plating for 2 024 aluminum alloy were studied. The experimental results show that TU and KIOa both can accelerate the deposition of Ni-P coating on aluminum alloy, and when the mass concentration of TU and KIO3 in the bath was 3 mg/L and 20 mg/L respectively, the deposition velocity of both is the highest. Furthermore, the optimal acceleration efficiency can be obtained by compounding TU and KIO3 at a mass ratio of 1 ： 5, and the Ni-P coating on aluminum alloy exhibits a good surface quality and corrosion resistance.
出处
《电镀与环保》
CAS
CSCD
北大核心
2010年第1期28-30,共3页
Electroplating & Pollution Control
关键词
2024铝合金
化学镀
加速剂
2024 aluminum alloy
electroless plating
accelerator
