摘要
研发了一种无铅无镉的化学镀镍新工艺，以两种新型稳定剂复合使用替代铅和镉，确定稳定剂SY-2的最佳用量为4mg／L镀液在6周期仍保持清澈透明，具有良好的稳定性；镀速在0～6周期之间为27～21μm／h，镀层磷质量分数为5．6％～9．0％，所得镀层光亮、硬度高、孔隙率低，具有良好的结合力和耐腐蚀性。该工艺镀液稳定性和镀层性能在一定程度上已超过了有铅有镉工艺，完全可以作为含铅、镉化学镀镍的替代品。
An EN （electroless nickel） process with lead free and cadmium free was developed, in which two new stabilizers were used to substitute for Pb and Cd. The optimum concentration of stabilizer SY-2 was established as 4 mg/L. The plating bath has a good stability even after 6 MTO, it is still clear. The deposition rate between 0-6 MTO is 27-21μm/h and the P content is 5.6%-9.0%. The EN deposit is bright and it has low porosity, high hardness and high corrosion resistance. The process performance is superior to the process with lead and Cadmium in a certain extent and can work as the substitute for Pb and Cd.
出处
《电镀与精饰》
CAS
2007年第2期27-30,41,共5页
Plating & Finishing
关键词
无铅无镉
化学镀Ni—P
新型稳定剂
lead free and cadmium free
electroless Ni-P plating
new stabilizer
