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2.5D SiO_(2f)/SiO_2复合材料制备工艺及性能研究 被引量:5

Preparation and Property of 2.5D SiO_(2f)/SiO_2 Composites
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摘要 采用溶胶-凝胶工艺制备2.5DSiO2f/SiO2复合材料,并对工艺参数进行了优化。研究表明:以固含量为30.73%的硅溶胶为浸渍浆料,采用微波干燥方式,烧结温度为900℃时制备的复合材料具有较好的性能。经过7个制备周期后,复合材料的密度为1.65g/cm3,此时弯曲强度最大,可达80.7MPa;800℃下烧成的材料具有最大的剪切强度和断裂韧性,分别为56.6MPa和3.5MPa.m1/2。测得试样介电常数为3.4,较好的满足了天线罩材料的介电性能要求。 In this paper, 2.5D SiO2f/SiO2 composites were fabricated by sol-gel method with 2.5D silica braid as reinforcement and high pure silicasol as slurry. The optimum parameters are as follows: silicasol of 30.73% as slurry, drying by microwave, sintering at temperature of 900 ℃. The density of composites can reach 1.65 g.cm3, and the maximal flexural strength is 80.68 MPa. The maximum shear strength and fracture toughness are 56.6 MPa and 3.5 MPa·m^1/2 when the specimen was sintered at 800 ℃. Dielectric properties of 2.5D SiO2f/SiO2 composites were also tested. It is 3.4 at 5 GHz and can well meet the requirements of radome materials.
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2009年第A02期458-461,共4页 Rare Metal Materials and Engineering
基金 二炮预研项目
关键词 2.5D SiO2f/SiO2 溶胶-凝胶 力学性能 介电性能 2.5D SiO2f/SiO2 sol-gel mechanical properties dielectric properties
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参考文献6

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