摘要
分析以往批处理清洗技术面临的问题及现代清洗技术的关键要求,介绍了采用臭氧的单晶圆清洗工艺,提出了臭氧清洗需要解决的问题。
This paper introduces the problems faced by previous batch cleaning technology and key requirements of modern cleaning technology,analyzes the single wafer cleaning technology by adopting the ozone,and puts forward some problems needing to be solved in the cleaning with the ozone.
出处
《科技情报开发与经济》
2009年第29期215-217,共3页
Sci-Tech Information Development & Economy
关键词
单晶圆清洗
批处理
交叉污染
成品率
臭氧
single-wafer cleaning
batch processing
cross-contamination
finished product ratio
ozone
