摘要
将自制的球形超细铜粉,通过球磨改性成为片状铜粉,同时进行化学还原和铜离子萃取,在银氨溶液中置换镀银,使银均匀地沉积在铜的表面,并借助球磨的机械作用使镀层更紧密,包覆更完全。该工艺过程简单,可兼顾成本和性能两方面要求,可一次性制备高性能、低成本的片状镀银铜粉。
The preparation of flake copper powders modified by ball milling was studied. The preparation of copper powders covered with flake silver by chemical reduction method , extraction of Cu ion and replacement plating of Ag in silver diamminonitrate solution was introduced. The plated Ag was deposited on the surface of copper powders evenly. This process is simple and practical and low cost.
出处
《贵金属》
CAS
CSCD
北大核心
2009年第4期25-28,共4页
Precious Metals
关键词
金属材料
镀银铜粉
片状
萃取
抗氧化性
导电性
metal materials
silver covered copper powder
flake
extraction
oxidation resistance
conductivity
