摘要
电子及封装技木的快速发展对封装材料的性能提出了更为严格的要求。综述了各种新型封装材料的发展现状;并以金属基复合材料为重点,分别从增强体,基体材料,制备工艺及微结构几个方面讨论了它们对材料热性能的影响;据此进一步提出了改善封装材料热性能的途径及未来的发展方向。
The rapid development of electronic and packaging technology has led to active search for newermaterials. This paper presents a review of the advancesm the development of the latest packaging materials Emphasisis placed on Metal Matrix Composite .and various factors which influence the thermal properties of materials including reinforcement .matrix .processing method and microstructure are discussed. Future trends and ways to improve properties are put forward accordingly.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2000年第9期28-32,共5页
Materials Reports
