摘要
采用热等静压的方法制备了SiCp／Cu电子封装复合材料．材料热膨胀系数（CTE）和导热率的测定表明，增加SiC体积分数和减小SiC颗粒的尺寸有利于降低CTE值；SIC质量分数超过26％这一临界值后，材料导热率会明显下降．减小残余应力有利于降低材料的CTE值．
SiC particle reinforced Cu matrix composites were fabricated via hot isostaticprocessing for electronic packaging. The results indicate that the coefficient of thethermal expansion (CTE) of composites depends on the SiC particle size and its volumefraction. The minimal CTE value has been obtained from an annealing for releasingresidual stress. The thermal conductivity is found to be higher when the volume fractionof Cu exceeds a threshold because of the matrix formed a continuous phase.
出处
《北京工业大学学报》
CAS
CSCD
1998年第3期34-37,共4页
Journal of Beijing University of Technology
基金
国家和北京市自然科学基金
关键词
电封装
复合材料
热膨胀系数
导热率
碳化硅
electronic packaging, SiCp / Cu composites, thermal expansion coefficientthermal conductivity
