摘要
采用熔融预聚法制备了4,4′-二苯甲烷双马来酰亚胺（BDM）/烯丙基苯基化合物（APC）/二苯甲烷二胺（MDA）/溴化环氧树脂（BER）多元共聚体系树脂,研究了预聚树脂的凝胶特性、贮存性、固化反应性及固化工艺。利用FT-IR、DSC、DMA、TG-DSC、SEM等测试手段分析表征了树脂体系的各种性能。结果表明,预聚树脂在常温下具有良好的均相稳定性,在高温下具有良好的固化反应性及粘接性。S-10固化树脂的玻璃化转变温度（Tg）为251℃,温度指数（Z15）为201,介电常数（ε,1 MHz）为3.66,热膨胀系数（CTE）为6.1992×10^-5/℃（室温-235℃）,氧指数（LOI）为31,吸水率为0.43%,弯曲强度为88.98 MPa,冲击强度为14.8kJ/m^2,该体系树脂可用作高性能覆铜板（CCL）的韧性基体树脂。
4,4′-diphenylmethanebismaleimide（BDM）/allyl phenyl compounds（APC）/diphenylm ethanediamine（MDA）/brominated epoxy resin（BER） copolymers were prepared by melting prepolymerization.The gelling property and curing processibility were studied.Properties of the resins were characterized by FT-IR,DSC,DMA,TG-DSC SEM,etc,which showed that the fresh resins have good storage stability and curing reactiveness and the cured resins possess good heat resistance,dielectric properties, mechanical properties and flame retardancy.Both of the modified BDM matrix resins have reached high performance levels.
出处
《绝缘材料》
CAS
北大核心
2009年第4期17-23,共7页
Insulating Materials
基金
湖北省化学研究院研究生课题基金资助项目
关键词
改性双马来酰亚胺树脂
溴化环氧树脂
耐热性能
介电性能
阻燃性
modified bismaleimide resins
brominated epoxy resins
heat resistance
dielectric properties
flame retardancy
