摘要
针对覆铜板的耐高温要求,分别使用胺类固化剂4,4′-二氨基二苯砜(DDS)、4,4′-二氨基二苯醚(DDE)和乙二胺(EDA)固化改性双酚A型环氧树脂,研制适用于耐高温覆铜板的环氧树脂固化物。用示差扫描量热法(DSC)研究其固化过程,讨论了固化剂用量、固化剂种类及固化温度等因素对固化物玻璃化转变温度(Tg)的影响。实验结果表明,固化物耐热性最好的配比不是化学计量,而是偏离化学计量,在理论用量的基础上适当增加固化剂用量,可有效地提高固化产物的玻璃化温度Tg值;使用芳香胺类固化剂固化双酚A型环氧树脂,其固化产物有较高的玻璃化温度,可以满足覆铜板耐高温的要求。
High temperature resistant epoxy resin suitable for copper clad laminate was prepared by curing bisphenol A epoxy resin with amine curing agents of 4,4'-diaminodiphenylsulfone(DDS),4,4'-diamin-odiphenylether(DDE)and ethyldiamine(EDA)respectively. The process of curing was studied by DSC. The effect of curing agent contents,curing agents and curing temperature on the glass transition temperature (Tg) of cured epoxy resin were discussed.The result indicates that the best ratio of the thermal stability deviated from stoichiometry. It can improve the glass transition temperature (Tg) efficiently by the increasing of curing agent amount appropriately on the base of the theoretic dosage. The cured resin can get a higher glass transition temperature(Tg) by using the aromatic amine curing agents,which is suitable for the heat-resisting requirement.
出处
《中国胶粘剂》
CAS
2005年第3期14-17,共4页
China Adhesives
关键词
二氨基二苯砜
二氨基二苯醚
环氧树脂
示差扫描量热法
耐高温
覆铜板
diaminodiphenyl sulfone
diaminodiphenyl ether
epoxy resin
differential scanning calorime-try
high temperature resistance
copper clad laminate
