摘要
导电胶具备无铅、分辨率高、柔韧性好、加工工艺简单、低温操作等优点而使其成为替代传统Sn/Pb钎料的理想的微电子互连材料。本文对微电子互连用导电胶的组成、分类、机理和研究现状等进行了综述。为进一步研究开发新型性/价比高的微电子互连用导电胶提供思路。
Conductive adhesives have become ideal microelectronic interconnection materials replacing Sn/Pb solders because of the advantages of being lead-free, offering finer pitch interconnection capability, excellent flexibility and less processing steps at lower temperature. The composition, classification, conductivity mechanism, advance of conductive adhesives are reviewed here to support ideas for developing new conductive adhesives as microelectronic interconnection materials with excellent properties/cost ratio.
出处
《中国胶粘剂》
CAS
2004年第6期43-48,共6页
China Adhesives
关键词
导电胶
微电子
微电子互连
综述
Conductive adhesive
microelectronic
microelectronic interconnection
review
