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基于LTCC的Ka波段无源等效腔体分析与优化设计 被引量:3

Analysis and Optimal Design of Passive Equivalent Cavity in Ka Wave Band Based on LTCC
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摘要 为了能够在Ka波段采用低温共烧陶瓷(LTCC)技术实现收发组件小型化设计,提出了LTCC无源等效腔体模型。将有源芯片置入LTCC腔体中,解决了电磁场干扰问题。但腔体效应会引起串扰和振荡,造成放大器工作的不稳定。为此提出腔体谐振频率远离工作频率的设计方法,在无源等效腔体设计过程中采用两种不同馈电结构,利用基于神经网络模型的遗传算法和三维电磁场仿真软件对无源等效腔体参数进行优化设计,得到了近似一致的设计结果,满足放大器稳定的最优无源等效腔体参数为4.5 mm×3.5 mm。 Equivalent cavity model based on low temperature cofired ceramics (LTCC) is put forward to realize package of the miniaturized transmission/receive module in Ka band. The interference of electromagnetic field is resolved by active chip embeded LTCC cavity. The crosstalk and os cillation of cavity effect is the main factor that causes instability of a power amplifier. The design method that the resonance frequency of cavity is away from the operating frequency is put forward. The two different feed configurations are adopted in the design of equivalent cavity. The parameter of equivalent cavity is optimized by genetic algorithm based on neural network and three-dimensional e- lectric and magnetic field simulation soft. The approximately identical result of the design is obtained. The optimal cavity dimension (4.5 mm × 3.5 mm) satisfies the amplifier stability.
出处 《南京理工大学学报》 EI CAS CSCD 北大核心 2009年第3期371-374,共4页 Journal of Nanjing University of Science and Technology
关键词 KA波段 等效腔体 无源腔体 低温共烧陶瓷 神经网络 遗传算法 Ka band equivalent cavity passive cavity low temperature cofired ceramics neural network genetic algorithm
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参考文献8

  • 1方大纲,陈彬.完全匹配层(PML)的研究进展[J].南京理工大学学报,1996,20(6):572-576. 被引量:5
  • 2Ponchak G E,Chen D H,Yook J G,et al.The use of metal filled via holes for improving isolation in LTCC RF and wire less multi-chip packages[J].IEEE Transactions on Advanced Packing,2000,23(1):88-89.
  • 3严伟,禹胜林,房迅雷.基于LTCC技术的三维集成微波组件[J].电子学报,2005,33(11):2009-2012. 被引量:37
  • 4Williams D F.Damping of the resonant modes of a rectangular metal package[J].IEEE Trans Microwave Theory Tech,1989,37(1):253-256.
  • 5Duffy S M.Design and analysis of microwave/millimeter wave active arrays using a multilayered packing architecture[D].Massachusetts State,USA:Department of Electrical and Computer Engineering,University of Massachusetts Amherst,1999.173-181.
  • 6梁晓芳.X波段固态功率放大器稳定性分析设计[J].现代雷达,2007,29(12):98-100. 被引量:8
  • 7Baiil I J,Iartia P B.微波固态电路设计[Z].南京:机械电子工业部第十四研究所,1991.61-115.
  • 8Cao Chengzhi,Wei Guanghua,Zhang Qidong.Optimization design of fuzzy neural network controller in direct torque control[J].Proceedings of 2004 International Conference on System Machine Learning and Cybernetics,2004,1(1):378-382.

二级参考文献11

  • 1A Contolatis,V Sokolov.90°RF vertical interconnects[J].Microwave Jour nal,1993,36(6):102-104.
  • 2Yan Wei,Fang Xunlei,Yu Shenglin,Fu Peng.High density packaging technologies for 3D integrated phased-array microwave modules[A].2004 Inter national Radar Conference(RADAR2004)[C].Toulouse,France,2004.
  • 3A lsarawi S F,Abbott D,Franzon P D A.Review of 3D packaging technology[J].IEEE Tran.On CPMT,Part B,1998,21(1):2-14.
  • 4F J Schmuckle,A Jentzsch,W Heinrich,et al.LTCC as MCM substrate:design of strip-line structure and flip-chip interconnects[A].2001 IEEE MTT-S Digest[C].Phoenix,USA,2001.1903-1906.
  • 5Dear nely,R W,A R F Barel.A broad-band transmission line model for a rectangular microstrip antenna[J].IEEE Trans.AP,1989,37(1):6-15.
  • 6Yan Wei,Fang Xunlei,Hong Wei.3D packaging & interconnecting techniques for microwave modules[A].6th Inter national Symposium on Antenna,Propagation,and EM Theory (ISAPE2003)[C].Beijing,China,2003.847-850.
  • 7Mark S Hauhe,John J Wooldridge.High density packaging of X-band active array modules[J].IEEE Trans.on CPMT,Part B.1997,20(3):279-291.
  • 8P Monfraix,P Ulian,C Drevon,et al.3D microwave modules for space applications[A].Proceedings of 1998 IEEE MTT-S Digest[C].Maryland,USA,1998.1289-1292.
  • 9蔡仁纲.电磁兼容原理、设计和预测技术[M].北京:北京航空航天大学出版社,1997.
  • 10於洪标.有源相控阵雷达T/R组件稳定性分析设计[C]//第七界科学技术报告会论文集.南京:南京电子技术研究所,2004:263-269.

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