摘要
用流体力学理论分析了ＩＣ制造技术中离心式涂胶过程胶液的受力流动状态，推导出反映涂胶厚度与离心机转速、胶液粘度等参数变化规律的数学模型，并通过此数学模型对离心涂胶过程的参数变化进行计算机模拟。经实际涂胶测定，该模型反映的变化规律与实际是相符的。
Flowing form of resist forced by centrifugal during process of spin coating used in IC manufacture is analyzed in this paper. Relationship among parameters of rotating speed, viscosity & coated resist thickness have been deduced in the view of liquid dynamics. Measured by practical spin coating and experiment, the changing rule reflected by the theoretical results is coincide well with the measuring data.
出处
《光学精密工程》
EI
CAS
CSCD
1998年第4期75-80,共6页
Optics and Precision Engineering
关键词
离心式涂胶
胶膜厚度
胶粘粘度
光刻
Spin coating, Liquid dynamics, Resist thickness, Viscosity
