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基于薄层SOI材料的NEMS结构制备技术

Fabrication of NEMS Structures on the Thin SOI Substrate
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摘要 提出一种基于薄层SOI材料的NEMS(nano-electro-mechanical-system)结构制备技术。通过大量实验研究,突破了电子束光刻、ICP刻蚀、CO2超临界干燥释放等工艺技术,可以在常规的薄层SOI材料上加工出任意复杂形状的NEMS结构。作为工艺验证器件,利用该技术在薄层SOI材料上成功实现了梳齿结构NEMS谐振器的样品制备。扫描电镜结果表明,谐振器厚度95nm,谐振梁宽度95nm,梳齿宽度128nm,梳齿间隙83nm,该加工技术可以实现结构完整、完全释放的NEMS结构。 A fabrication technology of NEMS (nano-electro-mechanieal-system) structures on the thin SOI substrate was presented. Using the technology of EBL (electron beam lithogra- phy), ICP (inductive coupled plasma) and CO2 supercritical drying release, any NEMS struc- tures can be fabricated on the ordinary thin SOl substrate. A novel comb resonator was fabrica- ted successfully on the thin SOI substrate to verify the process. The SEM (scanning electron microscope) photos show that the thickness of the width of comb and the gap between combs are 95, resonator, the width of resonant beam, the 95, 128, 83 nm, respectively. The NEMS structure is released successfully.
出处 《微纳电子技术》 CAS 北大核心 2009年第5期301-304,共4页 Micronanoelectronic Technology
基金 国家部委重点基金项目(9140A08080407DZ2301)
关键词 NEMS SOI 电子束光刻 ICP 释放 NEMS silicon on insulator (SOI) electron beam lithography (EBL) inductive coupled plasma (ICP)' release
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参考文献6

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