摘要
概括介绍了新型微电子封装技术—ＢＧＡ的基本概念、特点、封装类型、最新进展、生产应用等。
The paper introduces many questiones of BGA-a new microelectronic packaging technology, including basic concept,features,packaging types,production and applicationes.
出处
《电子工艺技术》
1998年第2期47-50,53,共5页
Electronics Process Technology
