摘要
烘箱HMDS预处理系统在提高光刻胶与硅片的黏附性方面具有很多优越性。文章通过对烘箱HMDS预处理过程的工作温度、PRIME时间、PRIME后保持时间等参数的优化实验,得到了最佳的烘箱HMDS预处理程序。通过提高烘箱工作温度(150℃)、减少PRIME时间(0.5min)和增加PRIME后保持时间(5min),最终降低了HMDS处理后的硅片接触角,进而降低了光刻胶28%的用量。本方法已经验证在本次开发中,其工艺稳定,完全适用于生产线量产。
HMDS vapor prime oven pre-process system has advantages in improving adhesion of photoresist and wafer. A series of factors that influence contact angle, such as temperature, prime time and bake time of HMDS vapor prime oven pre-process were studied in this paper. An optimized pre-process program was got. The dispense volume ofphotoresist can be reduced by 28% by reducing the contact angle. That it can be used in line was verified.
出处
《电子与封装》
2009年第4期37-39,共3页
Electronics & Packaging
关键词
HMDS
接触角
胶量
HMDS
contact angle
dispense volume
