摘要
采用喷射电铸法制备了不同硫脲浓度下的纳米晶铜铸层,用SEM、XRD方法分析了硫脲对纳米晶铜铸层微观结构和晶粒大小的影响,并对纳米晶铜铸层的力学性能进行了测试。结果表明,硫脲能细化晶粒,致密铸层组织,显著提高铸层的抗拉强度和显微硬度;电铸液中硫脲浓度为10mg/L时,可获得晶粒尺寸为29nm的致密铜铸层,其显微硬度和抗拉强度分别为3.1GPa和645MPa。电铸液中硫脲浓度从5mg/L增至10mg/L时,纳米晶铜铸层的择优取向由(220)晶面转变为(111)晶面。
Nanocrystalline copper was fabricated by jet electroforming with different concentration of thiourea. The microstructure and grain sizes of the copper deposits were studied by means of SEM and XRD, and the mechanical properties of nanocrystalline copper were measured. The results show that the fine grain and dense deposits with high tensile strength and mierohardness can be got by adding thiourea to the electrolyte, the dense nanocrystalline copper deposit with average grain size of 29 nm is fabricated with the thiourea concentration of 10 mg/L, the microhardness and the tensile strength of the nanocrystalline copper are 3.1 GPa and 645 MPa respectively. When the concentration of thiourea increases from 5 mg/L to 10 mg/L, the preferred orientation crystal face of nanocrystalline copper changes from （220）to（111）
出处
《金属热处理》
CAS
CSCD
北大核心
2009年第2期40-43,共4页
Heat Treatment of Metals
基金
国家自然科学基金项目(50175053)
关键词
硫脲
纳米晶铜
微观组织
力学性能
thiourea
nanocrystalline copper
microstructure
mechanical properties
