摘要
研究了在一定条件下 ,硫脲、明胶等添加剂的不同组合对高镍铜阳极电解阴极铜表面晶粒状况的影响 ,得出最佳实验条件为 :明胶 1 2mg/L ,硫脲为 1 0mg/L .此实验对改善阴极铜表面质量有一定指导及现实意义 .
In this thesis,some research work has been done to make clear the in fluence of additive combination of thiourea and gelatin etc on the surface quality of cathode copper the best experiment conditions is got:gelatin 12mg/L,thiourea 10mg/L, which has a directive furction and practical significance to improve the cathode copper surface qualily.
出处
《昆明理工大学学报（理工版）》
2002年第6期36-40,共5页
Journal of Kunming University of Science and Technology(Natural Science Edition)
关键词
结晶
添加剂
高镍铜阳极
表面质量
晶粒
电解
additive
high content of nickel copper anode
surface quality
crystal grain
