摘要
较为深入地叙述了ＳＭＴ焊点质量金相检测的基础理论，及质量金相检测的方法与要求；提出了ＳＭＴ焊点整体质量的概念与质量金相检测的主要程序；并列举了一些金相检测的实例。对于ＳＭＴ生产与ＳＭＴ工艺研究有重要的实用价值。
This article briefs the basic theory,method,demand and index of the metallographic examination of quality in SMT solder joint,advances the concept of overall quality in SMT solder jointas well as the main process of metallographic exmination of quality,also lists some examples of this examination.It has important practical value for SMT production and study of process in SMT.
出处
《电子工艺技术》
1998年第1期16-21,共6页
Electronics Process Technology
关键词
SMT焊点
检测方法
电子元件
SMT solder joint Basic theory Overall qulity Method of examination Example of examination
