摘要
以均苯四甲酸二酐(PMDA)、醚二胺(ODA)、乙酰胺(DMAc)等为原料,制得PI-SiC杂化复合材料,主要应用于微电子印刷电路包装密封方面。通过FTIR、TEM、阻抗分析仪、等手段证实了杂化材料中的有机成分与无机成分形成了氢键网络结构,材料的吸湿性能显著增强,吸水率为0.4%(85%RH),介电性能明显提高,介电常数降低到ε=2.2。
The PI-SiC hybrid composite material was made from PMDA, ODA, and DMAc, and it was used in sealed packaging and printed circuit of microelectronics. The hybrid composite material was con- firmed as the organic ingredients and the inorganic constituents formation of hydrogen bonds network struc- ture by the FTIR, TEM, and impedance analyzer. The hygroscopicity of the hybrid materials is significant- ly increased, and the water absorption was lowered to 0.4% （85 %RH） , the dielectric properties was obviously increased, and the permittivity was reduced to ε=2.2.
出处
《包装工程》
CAS
CSCD
北大核心
2008年第9期38-40,共3页
Packaging Engineering
基金
陕西理工学院科研基金资助项目(SLG0614)
关键词
层间绝缘
包装
研制
layer insulation
encapsulation
development.
