摘要
文章为了实现集成电路塑封生产的自动化,开发了自动上片机,其主要功能是对集成电路芯片引线框进行塑封前的自动上料排片及预热处理。控制系统采用工控机实现多运动同步控制,主要完成柔性流道直线运动、抓取机械手空间精确定位及预热工作台温度等的控制。基于Windows2000设计了专用工控系统软件,适用于DIP、QFP、SOP、TO等系列集成电路芯片的塑封生产,提高了生产效率和产品质量的稳定性。
In order to realize automation for plastic package of integrated circuit, an auto lead frame loader was designed. Its main function is to load and preheat lead frame automatically before molding. The synchronization control technique of mufti-movement was used in the control system. The movement of the flexible runner, precise positioning of the manipulator and temperature of the preheating platform were controlled by the system. The special industrial control software was also developed based on windows 2000. The system can be applied to the plastic package for DIP, QFP, SOP and TO series integrated circuits. The production efficiency and the stability of product quality would be improved greatly.
出处
《制造业自动化》
北大核心
2008年第8期92-94,共3页
Manufacturing Automation
基金
江苏省南通市科技创新计划项目(AA2006006)
关键词
集成电路
塑封
上片
自动化
integrated circuit
plastic package
lead frame load
automation
