摘要
将贵金属化合物溶液与特定的高聚物单体混合,在氨水、乙胺溶液的存在下,络合形成均匀稳定的分散体,再浸渍涤纶织物表面。升温过程中,高分子单体聚合以形成连续的网状结构限制了金属钯团聚。所生成的氨气对Pd2+与Ag+进行还原,原位生成了贵金属聚合物催化层。与传统的前处理工艺相比,无须使用SnCl2敏化,使此法无毒更简便易行。同时,减少了钯盐的用量,降低了成本。在织物上进行化学镀铜,并对其工艺参数进行了初步的研究。实验表明研制的电磁屏蔽材料表面电阻较小,厚度较薄,各方面的性能优良。
In this new pretreatment, noble metals compounds were mixed with some special high polymer monomers, and then formed a uniform and stable dispersed system, where the terylene fabric was immersed in. As the temperature was elevated, high polymer monomers formed continuous network structure which restricted the metal in aggregating. Reduction of Pd^2＋ and Ag^＋ was carried out by the formed ammonia and noble metal-polymer catalytic film was formed in-situ, which could cause chemical plating of copper on the fabric no need of sensitizing the fabric with SnCl2 . Preliminary investigation of the process was performed. When compared with the traditional pretreatment technology, this method is more convenient, non-toxic and reduces the amount of noble metals and production cost. The electromagnetic shielding material prepared by this method has many advantages such as smaller surface resistance and thinner.
出处
《纺织学报》
EI
CAS
CSCD
北大核心
2008年第1期49-53,共5页
Journal of Textile Research
关键词
前处理
原位生成
钯催化
化学镀铜
电磁屏蔽材料
pretreatment
form in situ
palladium catalyst
chemical plaiting of copper
electromagnetic shielding material
