摘要
采用胶态成型技术和优化的真空干燥工艺制备硅溶胶陶瓷型干坯料,并探讨焙烧工艺对其收缩率和抗压强度的影响。制备硅溶胶陶瓷型的原料有JN-30硅溶胶、石英粉和15%NH4Cl溶液。试验得到硅溶胶陶瓷型的最佳焙烧温度1050℃、保温时间2h。SEM照片表明,硅溶胶陶瓷型中耐火材料颗粒的形成是个长大过程,并产生少量裂纹。
Dry stock of silica sol ceramic mold was prepared by the colloidal molding technique and optimized vacuum drying process. Effect of roasting process on the shrinkage rate and compressive strength of silica sol ceramic mold was investigated. The materials used to prepare silica sol ceramic mold are JN-30 silica sol, silica powder and 15%NH4Cl solution. The optimum roasting temperature of silica sol ceramic mold gained by the experiments is 1 050℃ and holding time is 2 h. SEM shows that the refractory material particles in silica sol ceramic mold is a growing process during the roasting and cause small crack to occur.
出处
《铸造》
CAS
CSCD
北大核心
2008年第1期78-79,82,共3页
Foundry
关键词
硅溶胶
陶瓷型
焙烧
抗压强度
收缩率
silica sol
ceramic mold
roasting
compressive strength
shrinkage rate
