摘要
采用胶态成型技术制备硅溶胶陶瓷型。制备硅溶胶陶瓷型用材料有JN-30硅溶胶、石英粉和NH4Cl。研究发现,采用真空干燥的硅溶胶陶瓷型表面几乎无裂纹产生。试验得到硅溶胶陶瓷型的真空干燥工艺为:干燥温度80～100℃,干燥时间5h,真空度0.06～0.07MPa。重复试验得到硅溶胶陶瓷型收缩率(干燥收缩率和总收缩率)和抗压强度的期望为0.97%、1.04%和5.05MPa。结果表明,真空干燥可在硅溶胶陶瓷型制备工艺中应用。
Silica sol ceramic mold is prepared by using the colloidal casting processing technique. The materials used to prepare silica sol ceramic mold were JN-30 silica sol, silica powder and NH4Cl. Research finds that cracks not nearly appear on surface of silica sol ceramic mold dried by vacuum. Vacuum drying process of silica sol ceramic mold gained by the experimental is drying temperature 80-100℃, drying time 5h and vacuum 0.06-0.07 MPa. The expectancy of shrinkage ratio （drying shrinkage ratio and total shrinkage ratio） and compressive strength on silica sol ceramic mold gained by the repeated experimental are 0.97%, 1.04% and 5.05 MPa, respectively. The results show vacuum drvina can be used in DreDare Drocess of silica sol ceramic mold.
出处
《铸造》
EI
CAS
CSCD
北大核心
2007年第3期236-238,共3页
Foundry
关键词
硅溶胶
陶瓷型
真空干燥
收缩率
抗压强度
silica sol
ceramic mold
vacuum drying
shrinkage ratio
compressive strength
