摘要
依据IC晶圆的切割道和先进封装的工艺数据,分析划片机的误差,分配各功能部件的精度。依据桥形结构划片机的结构,建立工作台的力学模型,确定直线导轨的类型,研究直线导轨副工作台直线度的实现方法。
According to IC wafer＇ s street and process datum of advanced package, this article analyzed the error of Dicing saw and the accuracy distribution of functional parts. Based on the bridge-type frame structure of Dicing saw, mechanical model of table was established, linear motion rolling guide＇s type was chosen, the implementation method of linearity of table was researched.
出处
《电子工业专用设备》
2007年第12期35-39,共5页
Equipment for Electronic Products Manufacturing
关键词
误差分析
精度分配
直线度
均化效应
Error analysis
Accuracy distribution
Linearity
Averaging effect
