摘要
根据微电子工业的发展现状,论述发展全自动划片机的必要性;从全自动划片机的工作机理出发,分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术;依据分析结果提出相应的解决措施。
The necessity of developing full auto dicing saw is discussed according to development status of microelectronic industry. The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed. According to the analytic result, measures were put forward to solve problems.
出处
《电子工业专用设备》
2007年第2期28-32,38,共6页
Equipment for Electronic Products Manufacturing
关键词
空气静压电主轴
晶圆传输定位
自动对准
自动清洗
Air spindle Transfer and orientation of wafer Automatic alignment： Automatic wash
