摘要
用AES-350型俄歇电子能谱仪对普通锡铅焊料和抗氧化焊料自液态冷却的自由表面进行分析研究,证明普通焊料表面因Sn的富集,易于形成不断增厚的氧化层;而微量元素Ga在抗氧化焊料表面富集倾向远大于Sn,并形成不到10nm的富Ga表面保护膜。本文指出,在保护膜内高价Ga离子使表面层离子排列空位增加并使比电导降低,是产生抗氧化性的原因。
The free surface of cooled common Sn-Pb solder and antioxidable solder contained with trace Ga element were investigated by AES-350 Auger electron spectroscopy. The results show that on the surface of common solder the oxidized layer is continuously formed and grew as a result of enriching of Sn element, but on the surface of antioxidable solder, the enrichment of Ga is far stronger than that of Sn, and a protective film, which is less than 10 nm, is formed. The authors consider that in the protective film the ion vacancy increases and the specific electric conductivity of film reduces by the exist of Ga ion, which is the reason of yielding oxidation resistance.
出处
《东南大学学报（自然科学版）》
EI
CAS
CSCD
1989年第4期74-79,共6页
Journal of Southeast University：Natural Science Edition
关键词
电子谱法
锡
铅
焊料
抗氧化
tin, lead, solder, antioxidation, Auger electron, S, spectrometers
